Accelerated Stress Testing Handbook Guide for Achieving Quality Products

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Edition: 1st
Format: Hardcover
Pub. Date: 2001-05-25
Publisher(s): Wiley-IEEE Press
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Summary

As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST).The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame.Important topics covered include: Theoretical basis for AST General AST best practices AST design and manufacturing processes AST equipment and techniques AST process safety qualification In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs.

Author Biography

About the Editors H. Anthony Chan has been with AT&#38;T Labs and the former AT&#38;T Bell Labs for 14 years, specializing in product development and manufacturing, including interconnection technology, manufacture assembly and reliability, network management, and wireless network. He has been responsible for R&#38;D in robust product design and manufacture and for guiding various manufacturing locations in planning and conducting reliability and stress testing programs. Dr. Chan has taught several training courses in reliability and stress testing and is a regular speaker on these topics. Moreover, he is an adjunct faculty member at the Hong Kong Polytechnic University.<BR>Paul J. Englert is a distinguished member of the technical staff in the Product Realization Department of Lucent Technologies&#146; Wireless Networks Group. He is responsible for wide-scale deployment of mechanical computer-aided design (CAD) and work-in-progress data management solutions. Also, Dr. Englert develops Web-based, multimedia training tools for engineering practices and CAD tools and has lectured in China, Singapore, South Korea, and Taiwan on these subjects. Also, his experience spans a broad spectrum of projects in assembly, manufacturing, stress testing, chemical solvent replacement process development, and statistical modeling.

Table of Contents

Foreword xvii
Frank Ianna
Preface xix
Acknowledgments xxi
PART I OVERVIEW 1(30)
Introduction
3(7)
H. Anthony Chan
Paul J. Englert
Synopsis of Reliability Trends and Aim of Book
3(2)
Background of Military and Industrial Stress Testing Practices
5(1)
Overview of the AST Handbook
6(4)
References
9(1)
Principles of Stress Testing
10(21)
H. Anthony Chan
Paul J. Englert
Rationale for Stress Testing
11(8)
Product Robustness
11(1)
AST and Accelerated Testing
12(2)
AST and the Bath-Tub Curve
14(1)
Bimodal Product Strength Distribution
14(3)
Relevance of AST Failures
17(1)
Types of Stress Failures
18(1)
Stress Testing Technical and Implementation Issues
19(8)
Modes of AST
19(1)
Other Forms of Stress Testing
20(1)
Stress Stimuli and Flaws Precipitated by Them
21(1)
Stress Stimuli Selection
22(1)
Stress Level Determination
23(1)
Safety Testing
23(1)
Fault Simulation and Detection Issues
24(1)
Form of Product to Test
25(2)
Economic Issues
27(4)
Benefits
27(1)
Cost of AST
27(1)
Optimizing the Application of AST
28(1)
References
29(2)
PART II PROCESS AND GUIDELINES 31(60)
Stress Testing Program: Generic Processes
33(11)
H. Anthony Chan
Paul J. Englert
Overview of the Stress Testing Strategy
33(3)
Select AST Options
36(1)
Design Stress Testing (D-AST)
36(2)
Plan Program (A)
36(1)
Baseline Product (B)
36(1)
Take Corrective Action (C)
37(1)
Manufacturing Qualification Stress Testing (MQ-AST)
38(2)
Plan Program (A)
39(1)
Baseline Product (B)
39(1)
Take Corrective Action (C)
39(1)
Develop Manufacturing AST Regimen (D)
39(1)
Demonstrate Safety of the AST Regimen (E)
40(1)
Perform Manufacturing AST (F)
40(1)
Periodic Qualification Stress Testing (PQ-AST)
40(1)
Production Sampling Stress Test (PS-AST)
41(2)
Plan Program (A)
41(1)
Develop Manufacturing AST Regimen (D)
41(1)
Perform Manufacturing AST Regimen (F)
42(1)
Take Corrective Action (C)
42(1)
Optimize Manufacturing AST Regimen (G)
43(1)
Full Production Stress Testing (FP-AST)
43(1)
Stress Testing Program Subprocesses
44(22)
H. Anthony Chan
Paul J. Englert
Plan Program Subprocess (A)
44(6)
Form Team and Develop AST Strategy
44(2)
Review and Issue AST Strategy
46(1)
Write the AST Plan
47(1)
Review and Issue AST Plan
47(1)
AST Tools Realization
48(2)
Baseline Product Subprocess (B)
50(1)
Baseline Product
50(1)
Take Corrective Action Subprocess (C)
51(4)
Analyze AST Results
51(2)
Suggest and Review Corrective Actions
53(1)
Develop AST Verification Plan for Corrective Action
54(1)
Issue Summary of Lessons Learned
55(1)
Develop Manufacturing Stress Testing Regimen Subprocess (D)
55(2)
Determine the Form of Product to be Tested
55(1)
Determine What Stress Stimuli Are Effective
56(1)
Demonstrate Safety of the Stress Testing Regimen Subprocess (E)
57(4)
Develop AST Safety Strategy
58(1)
Write AST Safety Qualification Plan
58(1)
Execute Safety Qualification Plan
59(1)
Analyze Safety Test Data
60(1)
Certify Safety of Candidate AST Regimen
61(1)
Perform Manufacturing Stress Testing Subprocess (F)
61(1)
Execute AST Plan
61(1)
Optimize the Manufacturing Stress Testing Regimen Subprocess (G)
62(4)
Analyze Manufacturing AST Regimen Data
62(2)
Select Manufacturing AST Mode or Regimen
64(1)
Develop Evaluation Plan for Trial AST Regimen
64(1)
Conduct Evaluation of Trial AST Regimen
65(1)
Guidelines for Design and Manufacturing Stress Testing
66(25)
H. Anthony Chan
Paul J. Englert
AST Test Strategy
66(2)
AST Plan
68(1)
Sample Size Selection for Design AST
69(1)
Typical Stress Stimuli and Associated Product Flaws
70(1)
Recommended Stress Levels
71(6)
Baseline Product Test Procedures
77(6)
Failure Mode Analysis and Root Cause Analysis
83(4)
Failure Types and Modes Found During Stress Testing
85(2)
Corrective Action and Product Ruggedization
87(4)
Design AST Database
87(3)
References
90(1)
PART III THEORY 91(44)
Economics and Optimization
93(16)
H. Anthony Chan
Paul J. Englert
Guidelines for Optimizing Manufacturing Stress Testing
93(4)
Product Attributes
93(1)
Environment for Stress Testing
94(1)
The Optimization Process
95(1)
Effectiveness of the Stress Regimen
96(1)
A/B Comparisons
97(1)
Formulation
97(1)
Reliability Objective
98(1)
Types of Failures Revisited
98(1)
Distribution of Environmental Stresses
98(2)
Effect of Stress Testing
100(1)
Reliability Requirements
101(1)
Requirement on Service-Life Fraction Failed
101(1)
Requirement on Product Strength Distribution
102(1)
Examples
103(2)
1 in 100 Service-Life Fraction Failed Requirements
104(1)
1 in 1000 Service-Life Fraction Failed Requirements
104(1)
Economic Issues and Optimization
105(1)
Reduction in Field Failure Rate
105(1)
Potential Benefits
105(1)
Potential Costs
106(1)
Net Benefit
106(1)
Optimization
107(1)
Product Considerations
108(1)
Economic Summary
108(1)
References
108(1)
Reliability Growth
109(18)
Clifton J. Seusy
What Is Reliability Growth?
109(1)
How Many Units Must Be Tested?
110(1)
Binomial Probabilities
110(1)
Failure Mode Distribution
111(7)
Mathematical Substantiation
113(1)
Kuklinski Curves
114(4)
How Are These Units Acquired?
118(2)
Prototype Production
118(1)
Final Product Production
119(1)
The Success of Failures Attained by Stress Testing
120(4)
Generic Stresses
120(1)
Product-Specific Stresses and Stress Levels
120(1)
Relevance of Stress Failures
121(1)
Addressing All Failure Modes
122(1)
Design Defect Tracking
123(1)
Failure Analysis
124(1)
Results
124(1)
Conclusions
125(2)
Acknowledgments
125(1)
References
126(1)
Overview of the Failure Analysis Process for Electrical Components
127(8)
Greg Pfeiffer
Definition of Failure Analysis
127(1)
The Benefits of Performing Failure Analysis
127(1)
Overview of the Failure Analysis Process for Electrical Components
128(2)
Understand the Problem
128(1)
Examine the Component Package with a Low-Power Microscope
128(1)
Verify the Failure
128(1)
Nondestructive Evaluation
128(1)
Stop, Think, and Plan!
129(1)
Decapsulate the Device
129(1)
Examine the Interior of the Package and the Die Surface
129(1)
Conduct a Physical Analysis
129(1)
Evaluate the Data and Come to a Conclusion
129(1)
Develop a Corrective Action Recommendation
129(1)
Write and Issue a Report (as Required by the Customer)
130(1)
Archive the Data and Samples
130(1)
Follow Up on Customer's Corrective Action Results
130(1)
Tools for Component Failure Analysis
130(1)
Basic (Tools that Every Lab Needs)
130(1)
Additional Tools
131(1)
Personnel for Component Failure Analysis
131(1)
Challenges Facing Failure Analysts in the Future
131(1)
What the Customer Can Do to Optimize the Failure Analysis Process
132(3)
References
132(3)
PART IV EQUIPMENT AND TECHNIQUES 135(92)
Accelerated Stress Testing Equipment and Techniques
137(18)
Charles Felkins
Introduction
137(1)
Thermal Equipment
137(5)
Operating Temperature Range
138(1)
Temperature Rate of Change
138(2)
Mechanical Refrigeration versus Liquid Nitrogen (LN2) Cooling
140(1)
LN2 Implementation
141(1)
Vibration Equipment
142(5)
Issues for Repetitive Shock Machines Using Pneumatic Vibrators
144(1)
Multi-Axial Considerations for Repetitive Shock Machines
145(2)
Table Resonances for Repetitive Shock Machines
147(1)
gRMS versus peak G Stress
147(1)
Combined Thermal and Vibration Equipment
147(1)
Ancillary Mechanical Equipment for Stress Testing
148(4)
Fixturing for Vibration Stressing
148(1)
Printed Wiring Board Card Cages Used for Stress Testing
149(3)
Environmental Analysis Equipment Used for Stress Testing
152(1)
Electrical Test Equipment and Software Used for Stress Testing
153(1)
AST Test Equipment Hardware
153(1)
AST Test Equipment Software
153(1)
Other Stress Options
154(1)
Vibration and Shock Inputs Identify Some Failure Modes
155(27)
Wayne Tustin
Why Important?
155(1)
Vibration Measurements
155(9)
Prior Knowledge
155(2)
Vibration and Shock Measurement---Units
157(2)
Vibration and Shock Sensors (Field and Laboratory)
159(1)
Displacement Sensors
159(1)
Velocity Sensors
160(1)
Accelerometers
160(1)
Force Sensors
161(1)
Signal Conditioning
162(1)
Display and Recording Instruments
163(1)
Sources of Sensor Error
163(1)
Controllable Sources of Vibration and Mechanical Shock
164(6)
Electrodynamic (Electromagnetic) Shakers
164(1)
Shaker Armature
164(1)
Magnetic Field
165(1)
Alternating Current Generates Force
165(1)
Force Ratings
165(2)
Vertical or Horizontal Thrusting
167(1)
Isolation from Building
167(1)
Power Amplifiers
167(1)
Delivering Adequate Alternating Current for Shaker Driver Coil
167(1)
Momentary Power Peaks
168(1)
Importance of Low Distortion
168(1)
Direct Current for Shaker Field Winding
168(1)
Controls
168(1)
Controls for Sine Vibration Testing
169(1)
Controls for Random Vibration Testing
169(1)
Tolerances
169(1)
Abort Limits
169(1)
Controls for Shock Testing
170(1)
Test Fixtures
170(1)
Characteristics of Shock, Sine, and Random Vibration
170(6)
Mechanical Shock Pulse
170(2)
Sinusoidal Vibration and Its Effects
172(1)
Random Vibration and Its Effects
173(1)
Amplitude Probability Density
174(2)
Acceleration Spectral Density
176(1)
Multi-Axis Excitation
176(2)
Repetitive Shock Machines for Multi-Axis Stress Testing
178(1)
Using Random Vibration and Repetitive Shock for Stress Testing
178(4)
What Spectrum?
179(1)
What Intensity?
180(1)
For How Long?
180(1)
Is Our Production Screening Damaging Good Hardware?
180(2)
Relative Effectiveness of Thermal Cycling Versus Burn-In
182(7)
King Lo
Frank LoVasco
Introduction
182(1)
Results for Thermal Cycling Alone
183(1)
Intermittents and First Events
183(2)
Thermal Cycling versus Burn-In
185(1)
Failure Mechanisms
186(1)
Conclusion
187(2)
Acknowledgments
188(1)
Accelerated Qualification of Electronic Assemblies Under Combined Temperature Cycling and Vibration Environments: Is Miner's Hypothesis Valid?
189(14)
Kumar Upadhyayula
Abhijit Dasgupta
Introduction
190(1)
Combined Temperature and Vibration Accelerated Life Tests
191(3)
The Macroscopic Incremental Damage Superposition Approach (Macro-IDSA)
194(3)
The Micromechanistic Incremental Damage Superposition Approach (Micro-IDSA)
197(3)
Conclusions
200(3)
Acknowledgments
201(1)
References
201(2)
Liquid Environmental Stress Testing (Lest)
203(13)
Paul J. Englert
Advantages of Liquid Environmental Stress Testing
203(1)
Liquid Environmental Stress Testing Facility
204(4)
Overview of Lest Facility Features
204(4)
Thermal Considerations in Liquid Environmental Stress Testing
208(6)
Conclusions
214(2)
References
214(2)
Safety Qualification of Stress Testing
216(11)
S. Rajaram
Stress Testing Safety Qualification Program
217(6)
Generic Component Qualification
219(1)
IC Qualification
219(1)
Discrete Component Qualification
220(1)
Specific Code Qualification
220(1)
The Qualification Process
221(1)
AST with Voltage Bias
221(1)
THB Testing
222(1)
Product Destruct Limit Testing
223(1)
Safety Qualification Programs for Other Types of Stresses
223(4)
References
224(3)
PART V BEST PRACTICES CASE STUDIES IN COMPUTER, COMMUNICATIONS, AND OTHER INDUSTRIES 227(111)
Production AST with Computers Using the Taguchi Method
229(11)
Dennis E. Pachuki
Introduction
229(1)
Objectives
230(1)
Stress Overview
230(1)
Stress Screen Designs
230(2)
Temperature Range
230(1)
Temperature Change Rate
231(1)
Power Cycling
231(1)
Vibration Screen Determination
231(1)
Fixture Design
232(1)
Vibration Stress Duration
232(1)
Diagnostic Monitoring
232(1)
Experiment Overview
232(2)
Test Process Product Flow
233(1)
The Taguchi Method
234(2)
Sample Size Selection
235(1)
Response Variable Results and Conclusions of the Taguchi Experiment
236(1)
Triaxial Random Vibration
236(1)
Temperature Cycling
237(1)
Power Cycling
237(1)
Intra-Experiment Summary
237(1)
Taguchi Method Conclusion
238(1)
Terms
239(1)
Acknowledgments
239(1)
References
239(1)
Design AST With Vendor Electronics
240(13)
Charles Schinner
Introduction
240(1)
The Test-Analyze-Correct-Verify Process
240(2)
Accelerated Reliability Techniques (ART)
242(2)
Stress Tool Box
243(1)
Broad Spectrum Stress Portfolio
243(1)
Original Equipment Manufacturer (OEM) Power Supply Example
244(7)
Conclusions
251(2)
Acknowledgments
252(1)
References
252(1)
Design and Production AST With Power Supplies
253(10)
Donald Dalland
Background
253(1)
Switching Power Supplies
253(1)
STRIFE in New Product Development (Design AST)
253(4)
Vibration
254(1)
Thermal Test
255(1)
Electrical Overstress
256(1)
Power Cycling
256(1)
Results
256(1)
Conclusions with STRIFE in Product Development (Design AST)
257(1)
ESS in Manufacturing (Production AST)
257(4)
Burn-In
257(1)
Burn-In Conditions
258(1)
Results
258(1)
Vibration Screening
259(1)
Conditions
259(1)
Results
260(1)
Conclusions with ESS in Manufacturing (Production AST)
260(1)
Final Conclusions
261(2)
Acknowledgments
262(1)
Design and Production AST with Computers
263(6)
Edmond L. Kyser
Background
263(1)
A Massively Parallel RISC-Based Server
263(1)
The ESS Program
263(5)
Integration
264(4)
Conclusions
268(1)
Acknowledgments
268(1)
Definitions and Acronyms
268(1)
References
268(1)
Qualifications and Production Sampling AST with Printed Circuit Boards
269(13)
Harry McLean
Introduction
269(1)
Proposed Test and Theory
270(1)
Ongoing Monitoring of the Production Process
271(2)
Screen Development
273(1)
Equipment
274(1)
Results of the Initial Testing
275(3)
Conclusions
278(4)
Acknowledgments
280(1)
Glossary
280(1)
References
281(1)
Manufacturing AST with Telecommunication Products
282(18)
T. Paul Parker
Gordon L. Harrison
Introduction
282(2)
EST During Product Design (Design AST)
284(1)
Production EST (AST)
285(3)
Techniques of Production EST (AST)
286(1)
FMA and Corrective Action
287(1)
Production EST (AST) Studies at AT&T
288(3)
Facilities Hardware and Software
289(2)
Thermal Profile
291(1)
Results of the Thermal Cycling Studies
291(9)
Phase I Study
292(1)
Phase IIa
292(2)
Phase IIb
294(1)
Phase III
294(2)
Phase IV
296(1)
Future Studies
296(1)
Conclusion
297(1)
Acknowledgments
297(1)
References
298(2)
Production AST with Computer Disks
300(8)
Kevin Granlund
Introduction
300(1)
Growing Reliability
301(1)
Problem
302(1)
Case Study
302(1)
Product Flow
303(1)
Profile Utilized
304(1)
A Look at the Failure Mechanisms
304(2)
The Bottom Line
306(1)
Conclusion
307(1)
References
307(1)
Benchmarking
308(30)
Henry Malec
Introduction to Benchmarking
308(9)
Traditional Benchmarking
310(3)
Product Benchmarking
313(3)
AST Benchmarking
316(1)
The AST Benchmarking Process
317(8)
Benchmarking Partnerships---Otis Elevator Company and United Technologies/3Com Corporation (U.S. Robotics)
325(2)
Benchmarking AST Survey Data
327(2)
Summary
329(9)
Acknowledgments
329(1)
References
329(1)
Appendix A Environmental Stress Screening Questionnaire---1997
330(3)
Appendix B Environmental Stress Screening Questionnaire---1996 & 1997 Results
333(5)
Glossary of Stress Testing Terminology 338(2)
Bibliography 340(25)
Index 365(4)
Epilogue 369(2)
About the Editors 371

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